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Adhesives technology for electronic applications : materials, processes, reliability / by James J. Licari and Dale W. Swanson.
Material type:
TextSeries: Materials and processes for electronic applications seriesPublication details: Amsterdam : William Andrew Pub., c2005.Description: viii, 403 p. : ill. ; 24 cmISBN: - 9781437778892
- TK7871 .L53 2005
| Item type | Current library | Call number | Status | Barcode | |
|---|---|---|---|---|---|
| General Collection | Main Campus Library General Stacks | TK7871 .L53 2005 (Browse shelf(Opens below)) | Available | 00023960 |
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| TK7870 .D55 2002 Direct-write technologies for rapid prototyping applications : | TK7870 .E763 2003 Advanced simulation methods for ESD protection development / | TK7870.15 .G71 2012 Hermeticity of electronic packages. | TK7871 .L53 2005 Adhesives technology for electronic applications : materials, processes, reliability / | TK7871 .S56 2001 Passive components For circuit Design/Sinclair Ian | TK7871.15.C35 S96 1998 Carbon-based materials for microelectronics : proceedings of Symposium K on Carbon-based Materials for Microelectronics of the E-MRS 1998 Spring Conference, Strasbourg, France, June 16-19, 1998 / | TK7871.15.C4 I54 1998 Electroceramics VI '98 : |
Includes bibliographical references and index.
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