TY - BOOK AU - Licari,James J. AU - Swanson,Dale W. TI - Adhesives technology for electronic applications: materials, processes, reliability SN - 9781437778892 AV - TK7871 .L53 2005 PY - 2005/// CY - Amsterdam PB - William Andrew Pub. KW - Electronics KW - Materials KW - Adhesives KW - Electronic packaging N1 - Includes bibliographical references and index UR - http://www.loc.gov/catdir/toc/ecip0512/2005012647.html UR - http://www.loc.gov/catdir/enhancements/fy0632/2005012647-d.html ER -