000 | 01196nam a22003017a 4500 | ||
---|---|---|---|
999 |
_c6142 _d6142 |
||
005 | 20180924115129.0 | ||
008 | 180924b ||||| |||| 00| 0 eng d | ||
010 | _a 2012359712 | ||
016 | 7 |
_a015874777 _2Uk |
|
020 | _a9781437778595 | ||
020 | _a1437778593 | ||
035 | _a(OCoLC)ocn740631119 | ||
040 |
_aBTCTA _beng _clc |
||
050 | 0 | 0 |
_aTJ1280 _b.A38 2012 |
245 | 0 | 0 |
_aAdvances in CMP/polishing technologies for the manufacture of electronic devices / _cedited by Toshiro Doi, Ioan D. Marinescu, Syuhei Kurokawa. |
246 | 1 | 0 | _aCMP polishing technologies for the manufacture of electronic devices |
260 |
_aOxford ; _aNew York : _bElsevier, _cc2012. |
||
300 |
_axii, 317 p. : _bill. ; _c24 cm. |
||
504 | _aIncludes bibliographical references and index. | ||
520 | _aCMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. --P. 4 of cover. | ||
650 | 0 | _aGrinding and polishing. | |
650 | 0 | _aChemical mechanical planarization. | |
650 | 0 | _aElectrolytic polishing. | |
700 | 1 | _aDoi, Toshiro K., | |
700 | 1 |
_aMarinescu, Ioan D. _4edt |
|
700 | 1 |
_aKurokawa, Syuhei _4edt |
|
942 |
_2lcc _cBK |