000 01196nam a22003017a 4500
999 _c6142
_d6142
005 20180924115129.0
008 180924b ||||| |||| 00| 0 eng d
010 _a 2012359712
016 7 _a015874777
_2Uk
020 _a9781437778595
020 _a1437778593
035 _a(OCoLC)ocn740631119
040 _aBTCTA
_beng
_clc
050 0 0 _aTJ1280
_b.A38 2012
245 0 0 _aAdvances in CMP/polishing technologies for the manufacture of electronic devices /
_cedited by Toshiro Doi, Ioan D. Marinescu, Syuhei Kurokawa.
246 1 0 _aCMP polishing technologies for the manufacture of electronic devices
260 _aOxford ;
_aNew York :
_bElsevier,
_cc2012.
300 _axii, 317 p. :
_bill. ;
_c24 cm.
504 _aIncludes bibliographical references and index.
520 _aCMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. --P. 4 of cover.
650 0 _aGrinding and polishing.
650 0 _aChemical mechanical planarization.
650 0 _aElectrolytic polishing.
700 1 _aDoi, Toshiro K.,
700 1 _aMarinescu, Ioan D.
_4edt
700 1 _aKurokawa, Syuhei
_4edt
942 _2lcc
_cBK