| 000 | 01034nam a22002657a 4500 | ||
|---|---|---|---|
| 003 | OSt | ||
| 005 | 20210614080330.0 | ||
| 008 | 210614b ||||| |||| 00| 0 eng d | ||
| 020 | _a9781437778892 | ||
| 040 |
_aDLC _cDLC _duok |
||
| 050 | 0 | 0 |
_aTK7871 _b.L53 2005 |
| 100 | 1 |
_aLicari, James J., _d1930- |
|
| 245 | 1 | 0 |
_aAdhesives technology for electronic applications : _bmaterials, processes, reliability / _cby James J. Licari and Dale W. Swanson. |
| 260 |
_aAmsterdam : _bWilliam Andrew Pub., _cc2005. |
||
| 300 |
_aviii, 403 p. : _bill. ; _c24 cm. |
||
| 440 | 0 | _aMaterials and processes for electronic applications series | |
| 504 | _aIncludes bibliographical references and index. | ||
| 650 | 0 |
_aElectronics _xMaterials. |
|
| 650 | 0 | _aAdhesives. | |
| 650 | 0 | _aElectronic packaging. | |
| 700 | 1 | _aSwanson, Dale W. | |
| 856 | 4 | 1 |
_3Table of contents only _uhttp://www.loc.gov/catdir/toc/ecip0512/2005012647.html |
| 856 | 4 | 2 |
_3Publisher description _uhttp://www.loc.gov/catdir/enhancements/fy0632/2005012647-d.html |
| 942 |
_2lcc _cBK |
||
| 999 |
_c9335 _d9335 |
||