Advances in CMP/polishing technologies for the manufacture of electronic devices /
Advances in CMP/polishing technologies for the manufacture of electronic devices /
CMP polishing technologies for the manufacture of electronic devices
edited by Toshiro Doi, Ioan D. Marinescu, Syuhei Kurokawa.
- Oxford ; New York : Elsevier, c2012.
- xii, 317 p. : ill. ; 24 cm.
Includes bibliographical references and index.
CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. --P. 4 of cover.
9781437778595 1437778593
2012359712
015874777 Uk
Grinding and polishing.
Chemical mechanical planarization.
Electrolytic polishing.
TJ1280 / .A38 2012
Includes bibliographical references and index.
CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. --P. 4 of cover.
9781437778595 1437778593
2012359712
015874777 Uk
Grinding and polishing.
Chemical mechanical planarization.
Electrolytic polishing.
TJ1280 / .A38 2012