Advances in CMP/polishing technologies for the manufacture of electronic devices / edited by Toshiro Doi, Ioan D. Marinescu, Syuhei Kurokawa.

Contributor(s):

Material type: Text

TextPublication details: Oxford ; New York : Elsevier, c2012.Description: xii, 317 p. : ill. ; 24 cmISBN:

9781437778595
1437778593

Other title:

CMP polishing technologies for the manufacture of electronic devices [Portion of title]

Subject(s):

LOC classification:

TJ1280 .A38 2012

Summary: CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. --P. 4 of cover.

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Item type	Current library	Call number	Status	Barcode
General Collection	Main Campus Library General Stacks	TJ1280 .A38 2012 (Browse shelf(Opens below))	Available	00020399

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Includes bibliographical references and index.

CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. --P. 4 of cover.

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