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Advances in CMP/polishing technologies for the manufacture of electronic devices / edited by Toshiro Doi, Ioan D. Marinescu, Syuhei Kurokawa.

Contributor(s): Material type: TextTextPublication details: Oxford ; New York : Elsevier, c2012.Description: xii, 317 p. : ill. ; 24 cmISBN:
  • 9781437778595
  • 1437778593
Other title:
  • CMP polishing technologies for the manufacture of electronic devices [Portion of title]
Subject(s): LOC classification:
  • TJ1280 .A38 2012
Summary: CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. --P. 4 of cover.
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Holdings
Item type Current library Call number Status Barcode
General Collection Main Campus Library General Stacks TJ1280 .A38 2012 (Browse shelf(Opens below)) Available 00020399

Includes bibliographical references and index.

CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. --P. 4 of cover.

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